 MBOA (Multiband OFDM Alliance)Company Description:In support of developing the best overall solution for the emerging market in ultrawideband-based technology, the Multiband OFDM Alliance (MBOA) was formed in June 2003 and now numbers over 170 member companies. These companies support a UWB specification that is based on an OFDM approach, originally introduced by Texas Instruments in March 2003, which will enable the broadest possible range of applications and satisfy the requirements of consumers and regulatory agencies worldwide.The MBOA has been working closely to leverage its collective expertise in the creation and publication of a Multiband OFDM specification for UWB PHY technology and will work in harmony with other UWB standards bodies such as IEEE, WiMedia, Wireless USB Promoter Group, 1394 TA, CEA, and others as appropriate. The MBOA continues to conduct exhaustive testing to ensure a solution with the maximum coexistence characteristics possible with future and incumbent wireless services. The MBOA will work with worldwide regulatory agencies to promote and seek specific approval for MBOA-based devices worldwide. The MBOA has also created a forum for collaboration with and by all UWB ecosystem players including antenna vendors, test and measurement vendors, upper layer protocol applications, and interfaces. Dozens of engineers are active in various MBOA technical subcommittees developing and improving the specification in areas ranging from system definition, MAC, MAC-PHY interface, scalability, regulatory, and ranging. The MBOA membership includes some of the most influential players in the Consumer Electronics, Personal Computing, Home Entertainment, Mobile Phone, Semiconductor and Digital Imaging spaces, including: AboCom Systems, Adamya, Adaptive Labs, Adimos, Advanced Resources Corporation, Advanced Science & Technology Institute, Advantest, Agere Systems, Alereon, ALinx Technology, Allion Computer, Alpha Networks, Apex College, Appairent Technologies, Arounda, Artimi, Asahi Glass, Avocent, Blue7 Communications, Broadcom, Centre for Wireless Communications (University of Oulu), Centro de Tecnologia de las Comunicaciones S.A., Cetecom ICT, Chief Tek Electronics, Civcom, ClearComet Ventures, Codified Telenumerics, COMMAX, CommStack, Communication Networks (Aachen University), Complaince Certification Services, Computer Access Technology, Concrete Logic, Coventive Technologies, CoWare, CWINS (WPI), Creative Labs, Cypress, Delta Electronics, Denali Software, Einfochips, EIZO, Ellisys, Seiko Epson, ESRD of CSIST, ETS Product Service (USA), Faraday Technology, FDK Corporation, Femto Devices, Focus Enhancements, Fujitsu, Furaxa, General Atomics, Genesys Logic, Genius Instituto de Tecnologia, Globalintech, GP Electronics, GTN, Hewlett Packard, Hitachi, Hong Kong Applied Science and Technology Research Institute Company Limited, Huawei Technologies, Hysignal Minervian, Icron Technologies, IDT, INEX Multimidia, Infineon, Innovative Wireless Technologies, Inphi, Institute for Infocomm Research, Institute for Information Industry, Intel, Intermec, Invisible Computer, Jaalaa, Kisel Microelectronics, LETI, Leviton Voice Data Division, LG Electronics, LitePoint, Logitech, Marvell, Maxim, M.B. International, MCCI, MeshDynamics, MeshNetworks, Mewtel Technology, Micro Linear, Microsoft, Mindready, MindTree Consulting, Mitsubishi, Multirate Systems, Murata Manufacturing, National Cheng Kung University, NEC Electronics, Netac Technology, NewLogic Technologies, Nokia, Novatek Microelectronics, NVIDIA, OEA International, Oki Techno Centre (Singapore), Olympus, Open Interface, OrangeWare, Orthotron, Oxford Semiconductor, Oxygen Development, Panasonic, Philips, Positive Edge ASICs, Prancer, Profilo Telr@, Pulse-LINK, RadioPulse, Raritan, Realtek, Renesas Technology, RFDomus, RF Micro Devices, Samsung Electronics, San Diego State University (Networking Group), Seraphim, Shanghai University, Sharp, Silex, Sipex, SiWorks, Sony, Staccato Communications Worldwide Headquarters:
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