Conduction Cooling * Service * Development * Dynamic Engineering

Publication date on this website: Tuesday, June 02, 2009
Company: Dynamic Engineering
Category: Press Releases : Industry News (Market)

Summary:
Conduction Cooling is used in rugged systems where the chassis needs to be sealed to the environment. The heat generated by the electronics within the system is routed from within the sealed chassis to the outside of the chassis via conduction. Once outside the sealed portion of the chassis, the heat can be transferred to the surroundings with convection or conduction to another surface.

The advantage of the conduction cooling approach is that the electronics can be protected from dust, dirt and liquids, used where the potential for sparks would be dangerous, or where there is no air for cooling.

Generally, boards designed for conduction cooling have Industrial Temperature or better parts, and the boards are designed for a more challenging environment in terms of vibration, shock, condensation, etc.

The added capabilities of conduction cooled systems come at a premium compared to convection cooled designs. In rugged systems the added reliability more than compensates for the increased initial cost. www.dyneng.com

Full Text:
In tough times, it seems that service is one of the first things to go. Many companies have replaced personal support with a voice activated maze of inaccurate menu options.  Have you gone out to dinner only to be met by a hurried staff that is short on patience while serving you less meal for the original price? Have you been affected by cutbacks, layoffs and closures, and noticed temperaments rising as people are more easily frustrated? Dynamic Engineering is aware of the struggles many of our clients are facing both in the workplace and at home. We are taking extra steps to provide you with friendly, prompt service and support, as we believe that each interaction with a client is an opportunity to improve their project, and their day. In the sections that follow we have addressed what service means to Dynamic Engineering, provided some steps you can take to reduce your stress level, offered a relatively low cost “getaway” mini vacation option, and shared some information and tools for moving your conduction cooled requirements forward.  By working together, now more than ever, we can create solutions to ensure a positive tomorrow.


Conduction Cooling is used in rugged systems where the chassis needs to be sealed to the environment. The heat generated by the electronics within the system is routed from within the sealed chassis to the outside of the chassis via conduction. Once outside the sealed portion of the chassis, the heat can be transferred to the surroundings with convection or conduction to another surface.

The advantage of the conduction cooling approach is that the electronics can be protected from dust, dirt and liquids, used where the potential for sparks would be dangerous, or where there is no air for cooling.

Generally, boards designed for conduction cooling have Industrial Temperature or better parts, and the boards are designed for a more challenging environment in terms of vibration, shock, condensation, etc.

The added capabilities of conduction cooled systems come at a premium compared to convection cooled designs. In rugged systems the added reliability more than compensates for the increased initial cost.

ccPMC-SpaceWire provides 4 channels of SpaceWire compliant IO for rugged applications. Conduction Cooled, Rear IO, software programmable, independent channels, up to 200 MHz with DMA support. Time Code routing and generation. Drivers and reference applications available. SpaceWire cables, breakout, and connector boxes. http://www.dyneng.com/ccPmcSpaceWire.html

ccPMC-Parallel-TTL has a combination of TTL and 1-10 MHz 12 bit ADC´s. 64 TTL IO 32 TTL and 8 ADC and other combinations in a Conduction Cooled PMC. Large FPGA with room for custom state-machines, filtering, Change of State etc. Multi-channel DMA built in. Drivers and reference applications available. http://www.dyneng.com/ccpmc_parallel_ttl.html

ccPMC-Hotlink features 6 HOTLink transmitters and receivers. The receivers can be DC, AC, or transformer coupled. In addition 12 RS-485 IO are provided along with programmable termination. The RS-485 can be used for a low speed control bus to go with the HOTLink path or other user purpose. Rear IO, programmable rates, DMA support. Drivers and reference applications available.

ccPMC-BiSerial-III-TRANS is the transformer coupled conduction cooled version of the BiSerial III. 8 10/100 transformer coupled [up to 40 MHz] RS-485 IO ports with a Spartan III and plenty of room for your State-Machine designs. Internal and External FIFO memory, PLL, user switch. Drivers and reference applications available. http://www.dyneng.com/pmc_biserial_III_trans.html

Contact:
www.dyneng.com
831.457.8891
dedra@dyneng.com

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Santa Cruz, CA 95060

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